![]() If you read up on the reflow process in detail, as you MUST have already done to make this question more than idle time wasting, you will have found that temperature profiles - rates of temperature change, holding times and cooling times and temperatures are all tightly specified. Manufacturers design parts to meet the stresses of this process with an acceptable margin of safety. Components and board are heated up hot enough and long enough that they are well on the way to destruction. Probablility ~= 1.: Reflow soldering is an exercise in controlled death. But most of us would just end up with a work of art or a pile of smoldering slag. It is potentially able to work and an exceptionally skilled and experienced and well trained operator may be able to achieve somewhat acceptable results some of the time. The problem with this method is that it is inherently poorly controlled. It could certainly damage them too, and most probably would.Īre there any other pitfalls that I might encounter or would this method work well? I know there are better methods to reflow a board, like a reflow oven, but I'm specifically interested in how this method would work. Could this possibly damage the board? What about all the parts? Are there any other pitfalls that I might encounter or would this method work well? It would take some time to sweep the gun over the board and ensure all of the paste has reflowed and during this time the pre-heater would still be on. I could utilize a fixture like this to keep the gun perpendicular to the board and just move the gun in the x-y plane. ![]() Start the hot air gun and slowly sweep it over the board as the paste reflow.Once all the components have been placed, place the PCB onto a pre-heater and raise the temperature to, say, 100˚C.Use a stereo microscope to place the more fine pitched parts. Place components using a vacuum pick-up tool. ![]()
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